solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? usable past 80ghz ? low series resistance ? low capacitance ? high cutoff frequency ? silicon nitride passivation ? polyimide scratch protection ? lead free (rohs compliant) ? designed for easy circuit insertion ? available in pocket tape and reel ? can be mounted with solder or conductive epoxy description and applications m/a - com's mads - 001317 - 1500 single is a gallium arsenide flip chip schottky barrier diode. this de- vice is fabricated on omcvd epitaxial material using a process designed for high device uniformity and extremely low parasitics. this diode is fully pas- sivated with silicon nitride and has an additional layer of polyimide for scratch protection. the protec- tive coating prevents damage to the junction during automated or manual handling. the flip chip con- figuration is suitable for pick and place insertion. this device with can be attached with solder or con- ductive epoxy. the high cutoff frequency of this di- ode allows use through millimeter wave frequencies. typical applications include single and double bal- anced mixers in pcn transceivers and radios, police radar detectors, and automotive radar detectors. mads - 001317 C 1500 ordering information part number package mads - 001317 - 1500ag gel pack mads - 001317 - 1500ap pocket tape and reel
solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 electrical specifications @ + 25 c parameters and test conditions symbol units mads - 001317 - 1500 min. typ. max. junction capacitance at 0v at 1 mhz cj pf .020 total capacitance at 0v at 1 mhz 1 ct pf .030 .045 .060 dynamic resistance at 9.5 - 10.5ma rs ohms 4 7 forward voltage at +1ma vf1 volts .60 .70 .80 reverse breakdown voltage at - 10ua vbr volts 4.5 7 notes: 1. total capacitance is equivalent to the sum of junction capacitance cj and parasitic capacitance cp.
solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 absolute maximum ratings 1 parameter absolute maximum operating temperature - 65 c to +125 c storage temperature - 65 c to +150 c incident lo power +20 dbm incident rf power +20 dbm . mounting temperature +260 c electrostatic discharge ( esd ) classification 2 class 0 1. operation of this device above any one of these parameters may cause permanent damage. 2. human body model forward current vs temperature - 50c +125c 25c 0.00 0.01 0.10 1.00 10.00 100.00 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 forward voltage (v) forward current (ma)
solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 mounting techniques die attach for these devices is made simple through the use of surface mount die attach technology. this chip was designed to be inserted onto hard or soft substrates with the junction side down. this chip can be mounted with conductive epoxy or with solder. solder die attach : this device can be mounted with sn63/pb37 or rohs compliant solder. typical reflow profiles are provided on m/a - com application note m538, surface mounting instructions which can be found @ www.macomtech.com epoxy die attach : this device can also be attached with conductive epoxy. the assembly can be preheated to 125 - 150c. use a minimum amount of epoxy. cure epoxy as per manufacturers instructions. handling procedures the following precautions should be observed to avoid damaging these chips: cleanliness: the chips should be handled in a clean environment. do not attempt to clean die after installation. static sensitivity: schottky barrier diodes are esd sensitive and can be damaged by static electricity. proper esd techniques should be used when handling these devices. general handling: the protective polymer coating on the active areas of these die provides scratch protection, particularly for the metal air bridge which contacts the anode. die ca n be handled with tweezers or vacuum pickups and are suitable for use with automatic pick - and - place equipment.
solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 flip chip outline drawing 1. pad finish is .2 microns of gold over 4 microns of nickel.
solderable gaas flip chip schottky diode rev. v4 mads - 001317 - 1500 6 6 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 6 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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